(Replying to PARENT post)

They're already binning the M1 between the two models of the Macbook Air; one has a 7 core GPU, the other has an 8 core. They haven't outright said this is due to binning, but it seems very likely. Will probably be similar for upper-end models, but more CPU variations as well.

They're fabbing with TSMC, which has a really established history in high yields. Just think about the A13/A14 CPUs, which are probably the most voluminous single CPU models every fabricated by a company, yet have never been subject to binning to other lower or higher end models. As the chips get more complicated naturally there will be more fabrication issues, so I expect we'll see more binning, but it doesn't look like there's much cause for concern.

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(Replying to PARENT post)

Yep, TSMC has an 87% yield[1] at their "5nm" tier - better than at their 7nm tier, in fact.

[1]: https://www.anandtech.com/show/16028/better-yield-on-5nm-tha...

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(Replying to PARENT post)

I wonder if they do bin them though, just not for iPhones or iPads. Perhaps today's A13/A14s that have small defects are tomorrow's Apple TV or HomePod CPUs.
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